We have developed a process that combines the benefits  of fine feature embedded conductors with the many advantages of embedded component packaging.   Using this approach, we achieve high component packing density in mechanically and environmentally robust assemblies.
Key features that should be noted include:

• Complete elimination of copper  photolithographic and etching processes
• Minimized CTE mismatch throughout the assembly
• Low-temperature lead-free assembly
• Applicability to several types of substrates, including polyimide, LCP, ABF, and alumina