Current development projects are aimed at:

• Developing complex miniature electronic circuits applicable to MEMS sensing
• Exploring methods for achieving high component packing density
• Environmental testing of the encapsulated component technology
• Demonstration of fine feature capabilities of laser embedded conductors
• Ramping to high-volume production

These projects involve the company in a wide range of R&D issues including materials selection,  electronic design, development of test methodologies, and optimization of fabrication equipment.  Examples of work on miniature TI microcontrollers, Atmel microcontrollers,  miniature wireless sensors, wired sensors, high-density packaging, and environmental testing are available on this site.