Publications
- "Electronic Infrastructure and Packaging for Mesoscale Systems", C. P. Christensen and L. Beer, MEMS Alliance Newsletter, Nov. 2009.
- "Circuit Miniaturization Using Nanoparticle Conductors and Embedded Components", C. P. Christensen, MEPTEC/SMTA Medical Electronics Symposium, Phoenix, AZ September 2010.
- "Miniature MEMS Interface Circuits Using Nanoparticle Conductors and Embedded Components" , C. P. Christensen, IMAPS Device Packaging Conference, Phoenix, AZ, March 2011.
- "Providing the Infrastructure for Connecting to the World: One Sensor at a Time", C. P. Christensen, Sensors Expo, Rosemont, IL, June 2011.
- "Single and Double Layer Circuits with Laser-Embedded Nanoparticle Conductors", C. P. Christensen, Whitepaper, August 2010.
- "Looking outside the Hole: The Evolution of Via Drilling", Mike Adelstein and Paul Christensen, PCB Magazine, May, 2013.
- "Microfluidic Prototypes: A Virtual Vending Machine", Paul Christensen, Amir Harandi, Natalia Christensen, and Mike Adelstein, Commercial Micro Manufacturing, Vol. 8, Number 3.
- "Integration of Miniature Electronic Assemblies Using Nanoparticle Silver Conductors, Polymer Bump Connections, and Encapsulated Component Blocks", C. Paul Christensen and Natalya Christensen, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 6, Issue 4, April 2016, pp. 527-532.