Systems in a Module

Our modules are built with a unique approach that combines fine feature conductors with embedded component packaging.  This produces high component packing density in mechanically and environmentally robust assemblies.

Key features of the additive fabrication process are:

• ​​​Embedding of components in a monolithic block
• ​Use of nanosilver fine-feature conductors

​Follow links below to see:

• ​An example of very high component density
• Environmental testing data
• An example of a microcontroller module
• Approaches to component interconnection

Embedded surface mount components connected by nanosilver conductors