Using our fine-feature conductors and embedded leadless components, we have built MSP430 microcontroller modules that are highly miniaturized. These microcontroller systems in a package typically include 32 or 40 pin MSP430's, all associated passives, input signal processing components such as inverters or op amps, and LDO regulators. I/O connections can be optimized to for specific applications. In the version shown above and on the right, the module has 25 I/O pads and is designed to be mounted on a 25 conductor ribbon cable with 0.3 mm conductor pitch. Similar modules can be mounted on the ribbon cable to attach sensors, wireless links, power sources and other subsystems.
Standard modules have been developed around the MSP430G2553 and MSPFR5739 chips. These chips are also used on Texas Instruments' Launchpads and are easily programmable using the open source Energia IDE, Code Composer Studio, or IAR Workbench.