Embedded componentsComponents in our functional modules are embedded in monolithic blocks using high-temperature encapsulation compounds similar to those used in semiconductor fabrication. This produces a mechanically and environmentally robust assembly and eliminates the need for a printed circuit board. Components used in the modules are typically in leadless packages of the smallest available size.
|
A 32 pin QFN package and 0201 and 0603 passives embedded in an epoxy block. Interconnection is carried out in a later step.
|