Embedded component modules can interconnected in several ways to form complete, functional miniature systems. For example, vertical vias can be used to interconnect stacked module. Using this approach we have shown that complete wireless sensor nodes can be constructed that occupy only sugar-cube size volumes.
Alternatively, the miniature electronics modules can attached to conventional printed circuit boards using conductive epoxy or solder. This can bring the benefits of fine feature interconnects to easily fabricated boards with much larger feature sizes.
Distributed systems that place selected modules at optimum locations on bus cables can be fabricated for robotics and other applications. The miniature modules appear to be only a bump on even some of the smallest multi-conductor cables.
Interconnection of Modules
Stacking of modules to produce 3D assemblies. Vertical vias allow electrical interconnection.
Modules can be connected to conventional PC boards with conductive epoxy or by solder to an intermediate pad.
Distributed systems can be constructed with modules mounted on a multiconductor cable.